BENEFITS |
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Outstanding bond strength |
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Designed for cut/uncut enamel
and dentin |
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Only one application required |
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No etching, No rinsing |
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No mixing |
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Fluoride releasing |
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Self-leveling technology (Uniform adhesive layer) |
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Thin film thickness (8μm) |
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Less technique sensitive |
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Extended working time (5 minutes) |
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Available in bottle and unit dose |
| |
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INDICATIONS |
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Bonding of light or dual cured composite material to: |
|
|
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cut/uncut enamel and dentin |
|
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fractured porcelain/ composite repair |
|
| |
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PRODUCT PACKAGES AVAILABLE |
Tokuyama® Bond Force Introductory Kit |
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Unit Dose/0.1mL (x 20) |
|
 Disposable Applicators (x 25) |
Tokuyama® Bond Force Standard Kit (Unit Dose) |
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Unit Dose/0.1mL (x 50) |
|
 Disposable Applicators (x 50) |
Tokuyama® Bond Force Kit |
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Bottle/5mL |
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Disposable Applicators (x 50) |
|
 Dispensing Well |
Tokuyama® Bond Refill |
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5mL Bottle |
| |
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MICROTENSILE BOND STRENGTH (MPa) TO DENTIN ** |
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*
** |
Not a registered trademark of Tokuyama Dental Corp.
Courtesy of Dr. Rick Walter, Chapel Hill, North Carolina |
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3D SELF-REINFORCING TECHNOLOGY |
|
| |
RESIN-DENTIN INTERFACE |
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Image provided by Professor Tagami, Tokyo Medical
and Dental University |
